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 FMM3117VN Datasheet Rev. B2
April, 2004
FMM3117VN
12.5Gbps Dual-drive LN Modulator Driver IC 1. Features
1) 2) 3) 4) 5) 6) 7) 8)
High Speed Operation up to 12.5Gbps On-chip 50 ohm Termination for High Speed Data Input Rapid Rise/Fall Time : 25ps (Typ., 20-80%) Adjustable Output Voltage Swing :2.0Vpp to 2.85Vpp (50ohm Load) Adjustable Output Offset Level Single Power Supply Voltage : -5.2V Duty Ratio Adjustment 6mm x 6mm 32-pin Hermetically Sealed Ceramic Package
2. Maximum Ratings
The semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. The normal logic operation is not assured even within the ratings.
Table 2-1. Maximum Ratings
Parameter Supply Voltage Input Voltage Power Supply Current
Output Swing Control Voltage Output Offset Control Voltage Output Offset Control Current Duty Control Voltage Output Voltage
Symbol
Vss Vin Iss Vip VIB1,VIB2 IB1,IB2 Vdut Vout Tstg
Value -6.50 to 0.0 -2.0 to 0.5 500 Vss-0.5 to Vss+2.2 -8.0 to 0.5 50 Vss-0.5 to Vss+2.2 -3.1 to 0.5 -55 to 125
Unit V V mA V V mA V V degC
Storage Temperature
!
GaAs
CAUTION
This device contains Gallium Arsenide(GaAs). For safety, please observe the following: (1) Do not put devices in your mouth. Gallium Arsenide is dangerous if ingested. (2) Do not burn, crush, or process chemically. It is dangerous to inhale or ingest the gas, powder, or liquid which results from burning, crushing or chemical processing of the devices. (3) Discard devices separately from industrial and domestic wastes in accordance with the method specified by law.
1
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
3. Recommended Operating Conditions
The recommended operating conditions are the recommended values assuring normal operation and long term reliability.
Table 3-1. Recommended Operating Conditions
Limit Parameter Supply Voltage Input Data Level High Input Data Level Low Symbol VSS VIH VIL VISD Input Data Swing VISS Output Swing Control Voltage Output Offset Control Voltage Output Offset Control Current Duty Ratio Control Voltage Case Temperature Vip VIB1,VIB2 IB1,IB2 Vdut TC
Differential Input Data Swing = 0.25~1.20Vpp Single-ended Input Data Swing = 0.50~1.20Vpp
Condition Min. -5.46 -0.50 -1.20 0.25 Typ. -5.20 Max. -4.94 0.00 -0.25 1.20
Unit V V V Vpp
Differential Input Single-ended Input
0.5 Vss Vss 0 Vss 0 ---------
1.20 Vss+2.0 0.0 30 Vss+2.0 75
Vpp V V mA V degC
4. Electrical Characteristics
Table4-1. Electrical Characteristics
Parameter Maximum Data Rate Power Supply Current Output Voltage Swing (max.) Output Voltage Swing (min.) Rise Time Fall Time Output Low Voltage Crossing Adjustment Range Symbol fb Iss VOUTMAX VOUTMIN Tr Tf VOL Crossing Din/DinB=0.50Vpp VOUT=2.85VPP Din/DinB=0.50Vpp VOUT=2.85Vpp Cross=50% 20 to 80 % VOUT=2.5Vpp NRZ
VOUT=2.85VPP, IB1=IB2=0mA RL=50ohm
( Tc = 25 degC , Vss = -5.20V,RL=50ohm)
Limit Condition Min. 12.5G --2.85 -------3.0 45 Typ. --220 ----25 25 --Max. --280 --2.0 35 35 --55 Unit bps mA Vpp Vpp ps ps V %
Jitter RMS(OUT)
Jitter
---
---
3.0
ps
2
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
5. Block Diagram
Figure 5-1. Block Diagram
Vdut
Vip
50ohm*
75ohm*
Din Voltage Driver DinB
300 ohm
Dout DoutB
50ohm*
IP *On chip resistor values may vary.
IB1
IB2
Table 5-2. Truth table for Dout and DoutB
Din 0 1 DinB 1 0 Dout L H DoutB H L
3
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
6. Pin Description
Table 6-1 Pin Description
Pin Number
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Symbol
GND GND DinB GND GND Din GND GND GND Vdut Vss Vss Vip IP IB2 GND GND GND DoutB GND GND Dout GND GND GND IB1 GND GND Vss Vss GND GND
I/O
----I ----I ------I ----I --I ------O ----O ------I ------------Ground Ground
Function
Remarks
Complementary Data Input Ground Ground Data Input Ground Ground Ground Duty Ratio Control Supply Voltage Supply Voltage Output Swing Control Peak Current monitor (Vss) DoutB Offset Control Ground Ground Ground Complementary Data Output Ground Ground Data Output Ground Ground Ground Dout Offset Control Ground Ground Supply Voltage Supply Voltage Ground Ground
4
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
7. Package
Fig.7-1 Package Outline
[unit : mm]
5
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
8. Test Circuit
To external Bias circuit
Sampling Oscilloscope 32 1 Pulse Pattern Generator
DinB IB1
25 24
ATT
R3
Dout
Top View
Din DoutB
ATT
8 9
Vdut
Vip IP IB2
R3
17 16
R1 R1
C2 R2
C2
R2
A
To external Bias circuit
C1
Vss C1 : 0.33 uF C2 : 0.068 uF R1 : 0 to 500 ohm (10 turns) R2 : 500 ohm R3 : 50 ohm
6
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
9.Typcal Measurement data
Tc=25 deg.C, VSS = -5.2V, VIB1=VIB2=0V, 12.5 Gbps, PRBS 2^23-1, RL=50 ohm, VOUT=2.85 VPP
Fig. 8-1 Electrical Eye Diagrams of Dout [H: 20ps/Div. , V:0.5V/Div.]
Vss=-5.2V,Ta=25degC, VIB1=VIB2=0V, RL=50ohm
3.0 2.5 VOUT [Vpp] 2.0 1.5 1.0 0.5 0.0 -5.6 -5.2 -4.8 -4.4 Vip [V]
Fig. 8-2 VOUT-Vip Characteristics
-4.0
-3.6
-3.2
7
Eudyna Devices Inc.
FMM3117VN Datasheet Rev. B2
April, 2004
10. Schematic Diagram for Interconnection with LN modulator
External Bias-T
50
AC blocking inductor
50
AC blocking inductor
To LN Modulator
Dout
FMM3117VN
DoutB
DC blocking capacitor
To LN Modulator
DC blocking capacitor
-------------------------------------------------------------------------------------------------------------------------------1) The contents of this document are subject to change without notice. Customers are advised to consult with Eudyna sales representatives before ordering. 2) The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Eudyna semiconductor device; Eudyna does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Eudyna assumes no liability for any damages whatsoever arising out of the use of the information. 3) Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Eudyna or any third party or does Eudyna warrant non-infringement of any third-party's intellectual property right or other right by using such information. Eudyna assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. 4) The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Eudyna will not be liable against you and/or any third party for any claims or damages arising in connection with abovementioned uses of the products. 5) Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. 6) If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.
8
Eudyna Devices Inc.


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